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MBRB3030CT
Preferred Device
SWITCHMODEt Power Rectifier
These state-of-the-art devices use the Schottky Barrier principle with a proprietary barrier metal.
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* * * * *
Guardring for Stress Protection Maximum Die Size 175C Operating Junction Temperature Short Heat Sink Tab Manufactured - Not Sheared Pb-Free Packages are Available
SCHOTTKY BARRIER RECTIFIER 30 AMPERES, 30 VOLTS
Mechanical Characteristics:
* Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 * Weight: 1.7 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Lead and Mounting Surface Temperature for Soldering Purposes: * *
260C Max. for 10 Seconds Device Meets MSL1 Requirements ESD Ratings: Machine Model, C (>400 V) Human Body Model, 3B (>8000 V)
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TC = 134C) Per Device Per Leg Peak Repetitive Forward Current (At Rated VR, Square Wave, 20 kHz, TC = +137C) Per Leg Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) Storage Temperature Range Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR) Reverse Energy (Unclamped Inductive Surge) (Inductance = 3 mH, TC = 25C) Symbol VRRM VRWM VR IF(AV) 30 15 IFRM 30 A Value 30 Unit V
1 4 3
Leads are Readily Solderable
4 1 3 D2PAK CASE 418B STYLE 3
MAXIMUM RATINGS
A
MARKING DIAGRAM
AY WW IFSM 200 A B3030CTG AKA
IRRM Tstg TJ dv/dt W
2.0 -55 to +175 -55 to +175 10,000 100
A C C V/ms mJ
A Y WW B3030CT G AKA
= Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA.
(c) Semiconductor Components Industries, LLC, 2006
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
1
February, 2006 - Rev. 6
Publication Order Number: MBRB3030CT/D
MBRB3030CT
THERMAL CHARACTERISTICS (Per Leg)
Characteristic Thermal Resistance, - Junction-to-Case - Junction-to-Ambient (Note 2) 2. When mounted using minimum recommended pad size on FR-4 board. Symbol RqJC RqJA Value 1.0 50 Unit C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic Maximum Instantaneous Forward Voltage (Note 3), Per Leg (IF = 15 Amps, TC = +25C) (IF = 15 Amps, TC = +150C) (IF = 30 Amps, TC = +25C) (IF = 30 Amps, TC = +150C) Maximum Instantaneous Reverse Current (Note 3), Per Leg (Rated dc Voltage, TC = +25C) (Reverse Voltage = 10 V, TC = +150C) (Rated dc Voltage, TC = +150C) 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. Symbol VF 0.54 0.47 0.67 0.66 IR 0.6 46 145 mA Value Unit V
ORDERING INFORMATION
Device MBRB3030CT MBRB3030CTG MBRB3030CTT4 MBRB3030CTT4G Package D2PAK D2PAK (Pb-Free) D2PAK D2PAK (Pb-Free) Shipping 50 Units / Rail 50 Units / Rail 800 Units / Tape & Reel 800 Units / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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2
MBRB3030CT
ELECTRICAL CHARACTERISTICS
I F, INSTANTANEOUS FORWARD CURRENT (A) I F, INSTANTANEOUS FORWARD CURRENT (A) 100 100
TJ = 150C
25C
1
1
100C
100C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
0
0.1
0.2
0.3
VF, INSTANTANEOUS VOLTAGE (VOLTS)
VF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Maximum Forward Voltage, Per Leg
Figure 2. Typical Forward Voltage, Per Leg
0.01
I R , REVERSE CURRENT (A)
I R , REVERSE CURRENT (A)
0.1
0.1 0.01
100C
0.001 10-4 10-5 10-6
0.001 10-4 10-5 10-6 0
25C
0
5
10
15
20
25
30
5
10
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Maximum Reverse Current, Per Leg
Figure 4. Typical Reverse Current, Per Leg
TJ = 25C 5000 C, CAPACITANCE (pF) 3000 MAXIMUM TYPICAL 1000 800 600 1 10 VR, REVERSE VOLTAGE (V)
Figure 5. Capacitance
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3
III III II IIII IIII
III III III III III
1.0
1.0 TJ = 150C
TJ = 150C
II
25C 0.4 0.5 0.6 0.7 0.8 100C 25C 15 20 25 30
III
TJ = 150C
II II
II
IIII III III
10
10
MBRB3030CT
TYPICAL CHARACTERISTICS
I F(AV), AVERAGE FORWARD CURRENT (A) RqJC = 1C/W DC
20
SQUARE WAVE IPK = 5.0 (CAPACITIVE IAV LOAD)
I F(AV), AVERAGE FORWARD CURRENT (A)
30
RqJA = 25C/W
15
DC 10 (RESISTIVE LOAD) SQUARE WAVE IPK = 5.0 (CAPACITIVE IAV LOAD)
(RESISTIVE LOAD)
10
10 20
5
10 20
0
120
125
130 140 135 145 TC, CASE TEMPERATURE (C)
150
155
0
0
50 100 TA, AMBIENT TEMPERATURE (C)
150
Figure 6. Current Derating, Infinite Heatsink
Figure 7. Current Derating
I F(AV), AVERAGE FORWARD CURRENT (A)
10 DC (RESISTIVE LOAD) SQUARE WAVE 6
RqJA = 50C/W
PF(AV), AVERAGE FORWARD POWER DISSIPATION (W)
8
15 IPK = 5.0 (CAPACITIVE IAV LOAD)
10
(RESISTIVE LOAD)
TJ = 150C
DC
4 10 2 20 0 0
IPK = 5.0 (CAPACITIVE IAV LOAD)
10 20 5 SQUARE WAVE
50 100 TA, AMBIENT TEMPERATURE (C)
150
0
0
15 5 10 20 IF(AV), AVERAGE FORWARD CURRENT (A)
25
Figure 8. Current Derating, Free Air
Figure 9. Forward Power Dissipation
1.0 R(t), EFFECTIVE TRANSIENT THERMAL RESISTANCE (NORMALIZED) SINGLE PULSE
0.1
tp
Ppk t1
Ppk TIME
DUTY CYCLE, D = tp/t1 PEAK POWER, Ppk, is peak of an equivalent square power pulse.
DTJL = Ppk * RqJL [D + (1 - D) * r(t1 + tp) + r(tp) - r(t1)] where DTJL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t, for example, r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
0.01
0.1
1.0 t, TIME (ms)
10
100
1000
Figure 10. Thermal Response
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MBRB3030CT
PACKAGE DIMENSIONS
D2PAK 3 CASE 418B-04 ISSUE J
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 418B-01 THRU 418B-03 OBSOLETE, NEW STANDARD 418B-04. DIM A B C D E F G H J K L M N P R S V INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.310 0.350 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.052 0.072 0.280 0.320 0.197 REF 0.079 REF 0.039 REF 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 7.87 8.89 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 1.32 1.83 7.11 8.13 5.00 REF 2.00 REF 0.99 REF 14.60 15.88 1.14 1.40
C E -B-
4
V W
A
1 2 3
S
-T-
SEATING PLANE
K G D H
3 PL M
W J
0.13 (0.005) VARIABLE CONFIGURATION ZONE L M
TB
M
R
N U L
P L M
STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE
M
F VIEW W-W 1
F VIEW W-W 2
F VIEW W-W 3
SOLDERING FOOTPRINT*
8.38 0.33
10.66 0.42
1.016 0.04
5.08 0.20
3.05 0.12 17.02 0.67
SCALE 3:1 mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MBRB3030CT
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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MBRB3030CT/D

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